Silicone Potting

Electronic Grade Silicone Potting Gel – KE-1052 A/B. Basic “workhorse” general purpose gel, exhibiting outstanding electrical properties and environmental stability. Features room or elevated temperature cure, 1:1 mix ration, 65mm penetration, high transparency, and a 4 hour pot life. Excellent adhesion to most all substrates.

Electronic Grade Silicone Potting Gel – KE-1052D A/B. Same physical and electrical properties as the KE 1052. Faster cure of 15 minutes at 100°C and 45 minute pot life. Full cure at 25°C in 4-5 hours.

Electronic Grade Silicone Potting Gel – X-832-050 A/B. Same properties as KE 1052 and KE 1052D but exhibiting the fastest cure at low temperature; 5-7 minute gel time at room temperature – full cure in 60 minutes. Best candidate for high speed, automated “no energy” processing.

Electronic Grade Silicone Potting Gel – X-832-184 A/B. 1:1 mix ratio with softest penetration of 100mm. Formulated for stable modulus characteristics in the
presence of adjacent silicone elastomers containing excess Si-H. Has been used to resolve solder bump elongation and breakage problems in flip chip assemblies.

Electronic Grade Silicone Potting Gel – KE 1057. Similar Properties to KE 1052D A/B. Formulated as a one component heat cure material in 10 minutes at 150°C.

Electronic Grade Silicone Potting Gel – KE-110 A/B. 10:1 mix ratio, 65mm penetration heat curable system. Most economical phenyl based system.

Electronic Grade Silicone Potting Gel – KE-1056. One-component, 95mm penetration, heat cure gel with an outstanding pot life of 2-3 months at room temperature.

Electronic Grade Silicone Potting Gel – X-832-054 A/B. Two component system with similar physical and electrical properties as KE-1056. Exhibits a 95mm penetration, but has a 5-7 minute gel time at room temperature.

Electronic Grade Silicone Potting Gel – FE-57. One-component, 65mm penetration, heat cured system with a long pot life (> 12 days) at room temperature.

Electronic Grade Silicone Potting Gel – FE-58. Thixotropic version of FE 57; used as a blob top or semiconductor die coating for fuel censor circuitry

Electronic Grade Silicone Potting Gel – FE-53 A/B. Two-component, 1:1 mix ratio, long pot life (>5 hours) gel. Must be heat cured. Most economical fluorosilicone alternative.